As electronic devices become an ever increasing part of our daily lives through further integration into the products that we regularly use, OEMs’ challenges associated with advancing complexities and miniaturization of technology brings new power consumption, heat, thermal design and thermal engineering challenges. The impact of “The Internet of Things” further integrates high performance electronic devices into both traditional and non-traditional applications at exponential rates, with the expectation that these devices are higher powered, smaller, streamlined and efficient with vibrant displays and trusted performance. Heat management, effective thermal conductivity and thermal management solutions become a serious bottleneck to device evolution.
Boyd’s TransTherm™ thermal management products are a widely diverse set of passive cooling solutions with optimized thermal conductivity ideal for applications in a variety of markets including automotive electronic control units, display technology heat spreading, mobile computing CPUs, batteries, display modules, enterprise electronic chip and heat sinks, LED lighting, lithium-ion hybrid or electric vehicle batteries, and other high performance applications.
In 2016, Boyd Corporation introduced Densified SOLIMIDE® polyimide open-cell foam as an enhanced thermal shield with excellent vibration damping capabilities ideal for thermal management in small spaces.
Interested in Thermal Management? Ready to receive a quote or just need to know additional information? Contact Us Download the Thermal Management line card here! Download Download the TransTherm™ catalog here! Download Download the technical paper on Thermal Management here! Download
Interested in our Thermal Management? Ready to receive a quote or just need to know additional information? Contact Us